.

오푸닝 174.***.196.11

반도체 공정에 필요한 Photolithography, Metal Deposition, wet etch and clean, Dry Etch, semiconductor device analysis , JMP 를 이용한 Statistical Process Control and data analysis, Defect Inspection and Correcting processes to reduce or remove defects and/or improve performance 를 하신분들이면 좋겠네요.